Что (кто) такое Ball Grid Array - определение

TYPE OF SURFACE-MOUNT PACKAGING

BGA2; Micro FCBGA; Ceramic ball grid array; BGA1; FBGA; Ball Grid Array; EBGA; PBGA; Micro-FCBGA; MicroBGA; ΜFCBGA; Plastic ball grid array; Plastic Ball Grid Array; Ball-grid array; LFBGA; Micro Ball Grid Arrays; Mbga; TFBGA; LBGA; UFBGA; UBGA; TBGA; Dye & pry; Dye and pry; Micro Ball Grid Array; Bga mount

EBGA

Enhanced Ball Grid Array (Reference: BGA, CPU, IC)

Pin Grid Array

TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE

SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array

<hardware> (PGA) A style of integrated circuit socket or pin-out with pins laid out on a square or rectangular grid with a separation of 0.1 inch in each direction. The pins near the centre of the array are often missing. PGA is often used on motherboards for processors, e.g. Socket 6 and Socket 8. PPGA is "plastic PGA" (as opposed to ceramic?). See also SPGA. (2000-03-09)

Staggered Pin Grid Array

TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE

<hardware> (SPGA) A style of integrated circuit socket or pin-out with a staggered grid of pins around the edge of the socket, positioned as several squares, one inside the other. SPGA is commonly used on motherboards for processors, e.g. Socket 5, Socket 7 and Socket 8. See also PGA. [Better description?] (1999-08-04)

Википедия

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

BGAs were introduced in the 1990s and became popular by 2001.

Soldering of BGA devices requires precise control and is usually done by automated processes such as in computer-controlled automatic reflow ovens.

https://en.wikipedia.org/wiki/Ball grid array